Designing automotive silicon with modern system architectures in mind

Renesas Daniel Sisco
Director Automotive Systems and Innovation, Renesas

Resulting from the ever-increasing levels of system complexity and interconnectedness, Tier2 chip providers are driven to design, test, and market their products with an increased focus on automotive systems and system integration. Modern automotive architectures and integration requirements drive design choices at the chip level, such as interconnect optimizations, trade-offs between generic or specific computing power and IPs, and optimized cache and pipelines chains. Without strong system level knowledge, making smart SoC design choices for modern automotive applications will become increasingly difficult. This talk will explore a unique approach to system level thinking for silicon design, and explain the importance of such an approach.

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